ASE Technology Holding Co., Ltd. (ASX) Stock Price
ASXStock
$39.53+34.82%52W
Market Cap$86.92B
P/E72.79x
PEG Ratio4.96
Div yield6.92%
Beta1.55
ASX Share Price Chart
Favorite Metrics
Price vs S&P 500 (26W)60.83%
Price vs S&P 500 (4W)12.23%
PEG Ratio4.96
VGM Score57.10
P/E Ratio (Annual)72.79x
Indicated Dividend Yield (Annual)6.92%
ASX Earnings Surprise History
| Quarter | Report date | EPS estimate | EPS actual | Surprise |
|---|---|---|---|---|
| Q2 2026 | $0.01 | $0.01 | +43.40%(+$0.00) | |
| Q1 2026 | $0.01 | $0.01 | +16.34%(+$0.00) | |
| Q4 2025 | $0.01 | $0.01 | +6.22%(+$0.00) | |
| Q3 2025 | $0.00 | $0.00 | +20.34%(+$0.00) | |
| Q2 2025 | $0.00 | $0.00 | -23.09%(-$0.00) |
ASX Analyst Recommendations
Jun 2026
Jul 2026
Aug 2026
Sep 2026
4.19
4.19
4.31
4.31
Industry Peers — Semiconductors(108)
| Symbol | Value Score | Growth Score | Momentum Score | P/S Ratio (TTM) | Revenue Growth TTM (YoY) | Gross Margin (TTM) | ROE (TTM) | Price |
|---|---|---|---|---|---|---|---|---|
ASXASE Technology Holding Co., Ltd. | D | C | B | 4.2x | 14.5% | 19.5% | 17.3% | $39.53 |
| NVDANvidia Corp | D | A | B | 17.0x | 83.4% | 74.7% | 110.1% | $214.13 |
| TSMTaiwan Semiconductor Manufacturing Company Ltd. | D | B | B | 12.8x | 36.2% | 65.8% | 41.2% | $412.61 |
| AVGOBroadcom Inc. Common Stock | D | A | C | 17.6x | 48.7% | 68.8% | 43.9% | $328.75 |
| SKHYSK hynix Inc. American Depositary Shares | B | A | B | 4.9x | 145.0% | 76.3% | 100.1% | $136.49 |
| MUMicron Technology, Inc. | C | A | A | 7.5x | 256.3% | 80.7% | 91.8% | $878.84 |
| AMDAdvanced Micro Devices | F | B | A | 20.9x | 39.5% | 53.2% | 10.1% | $528.75 |
| INTCIntel Corp | D | D | B | 8.3x | 7.5% | 38.6% | -10.8% | $89.85 |
| AMATApplied Materials Inc | D | C | C | 10.5x | 7.8% | 49.4% | 40.4% | $409.29 |
| TXNTexas Instruments Incorporated | D | C | A | 13.0x | 16.7% | 58.3% | 35.8% | $276.48 |
| ARMArm Holdings plc American Depositary Shares | F | B | B | 50.7x | 25.1% | 97.5% | 13.0% | $227.80 |
About ASE Technology Holding Co., Ltd.
ASE Technology is a leading Taiwan-based semiconductor assembly and testing company, with over half of its revenue from U.S.-based customers. The Packaging segment, its largest business, converts bare semiconductors into finished products with enhanced electrical and thermal performance. The company also provides front-end engineering testing, wafer probing, and final testing services, plus designs and manufactures electronic components and telecommunications equipment.